Another "Gold Rush": 3 Roll Milling Machine, the Precision Drivers Behind the Foundation of AI Computing Power
2026-02-17 11:30
2025 has been hailed by the tech industry as the "Year One of AI Practicalization." OpenAI launched GPT-5, Google DeepMind released Gemini 3.0, and domestic large-model companies have intensively rolled out solutions across various industries. From autonomous driving decision systems to protein structure prediction in scientific research, AI is reshaping our world.
Chips, the "Heart" of AI
AI chips are primarily used for two major tasks: "training" and "inference," relying heavily on large-scale parallel matrix operations. Unlike traditional CPUs, specialized chips such as GPUs and TPUs contain thousands to tens of thousands of computing cores, capable of processing massive amounts of data simultaneously.
High-performance AI chips face three major challenges: high power consumption, severe heat generation, and signal density. For example, NVIDIA's H100 has a power consumption of 700 watts, generating substantial heat, while signal transmission demands extremely high reliability. This makes a critical material in semiconductor packaging—gold paste—absolutely vital.
What is Gold Paste?
Gold paste is a sintered conductive paste composed of fine gold powder, glass powder, and an organic vehicle. After high-temperature sintering, the organic vehicle volatilizes, and the gold particles and glass powder melt and bond together, forming a dense, highly conductive, and highly reliable connection or coating.
Core Applications of Gold Paste in AI Hardware Manufacturing
AI computing power relies on high-performance semiconductor chips, and the advanced packaging technologies for these chips are precisely where gold paste excels. Gold paste is primarily used for:
- Chip-to-Substrate Bonding: When attaching AI chip dies to packaging substrates or carriers, a highly thermally and electrically conductive bonding material is required. Gold paste (especially gold-tin eutectic solder paste) represents the highest-end option. It forms a metallurgical bond with a stable melting point and exceptional strength at specific temperatures, providing superb thermal conductivity and mechanical strength. This is critical for AI chips with massive power consumption and intense heat generation.
- Internal Interconnects in Packaging: In some advanced packaging (e.g., 2.5D/3D packaging), gold paste can be used to create tiny vertical interconnect vias or connection points.
- High-Reliability Electrodes and Contacts: Gold paste is used to print electrodes in areas requiring extreme stability and resistance to migration.
Why Do AI Chips Specifically Need Gold Paste?
- Thermal Dissipation Requirements: A high-end AI chip can consume several hundred watts or even over a kilowatt. Gold paste connections provide an optimal thermal conduction path, rapidly transferring the immense heat generated by the chip to the heatsink, preventing overheating, frequency throttling, or damage.
- Signal Integrity: AI chips have thousands of tiny connection points. Gold paste connections offer low resistance and excellent stability, ensuring the integrity of high-speed electrical signal transmission, reducing loss and delay.
- Long-Term Reliability: AI hardware in servers and data centers needs to operate 24/7, 365 days a year, for several years. Gold possesses excellent chemical stability, is not prone to oxidation or electromigration, and guarantees the long-term reliability of connection points under sustained high-temperature and high-stress conditions.
Gold Paste is Extremely Expensive. Why Not Choose Alternative Materials?
- Silver Paste: Offers better conductivity and lower cost but carries the risk of silver migration (dendrite growth in humid environments, potentially causing short circuits), compromising long-term reliability compared to gold.
- Copper Paste: Has the lowest cost but is highly susceptible to oxidation. Sintering requires an inert gas atmosphere, making the process more complex.
- Conductive Adhesives/Epoxy Resins: Low cost and simple process, but their thermal and electrical conductivity are far inferior to metal-sintered materials.
In common consumer electronics, engineers might opt for more economical silver or copper paste. However, for an AI server chip valued at tens of thousands of dollars, requiring 24/7 uninterrupted operation for several years, gold paste, with its unparalleled comprehensive performance, has become the irreplaceable, preferred material for high-end AI chip packaging. This is precisely why gold paste is the top choice for advanced AI chip packaging.
3 Roll Milling Machine: The "Precision Calibrator" of Gold Paste Performance
The performance of gold paste is fundamentally determined by the particle size and uniform dispersion of its key component: gold powder. Grinding bulk gold into particles thousands of times finer than a human hair, and ensuring these particles are uniformly dispersed within the vehicle without agglomeration or sedimentation—this is the core function and value of the 3 roll milling machine, and a critical step determining gold paste quality.
The working principle of a 3 roll milling machine appears simple: three parallel rollers rotate at different speeds; gold paste is fed into the roller gap and subjected to immense shear force for grinding and dispersion. However, the control of its process parameters is exceptionally precise:
- Roller Gap: Controlled at the micron level, approximately one-tenth the diameter of a human hair.
- Roller Speed: The speed ratios of the three rollers are meticulously designed, creating a velocity gradient that generates powerful shear force.
- Temperature Control: The grinding process generates heat; precise temperature control is essential to prevent degradation of the organic vehicle.
- Pressure Adjustment: The pressure between rollers must be uniform and stable to ensure batch-to-batch consistency.
ZYE High-Precision 3 roll milling machine utilize rollers made from high-hardness materials, processed through specialized sintering techniques for high density, achieving micron-level precision. They can grind gold powder to an ideal micron-sized particle distribution while ensuring uniform dispersion of the gold powder within the vehicle. The uniformity and dispersion degree of the gold paste directly impact the heat dissipation efficiency and packaging yield of AI chips—every grade of improvement in uniformity significantly enhances the chip's thermal performance and reduces the risk of packaging failure.
Positioned upstream in the industrial chain, the 3 roll milling machine's precision influences gold paste performance, subsequently affecting the reliability of AI chips and the stability of the entire AI system. This "butterfly effect" tightly links precision equipment to the realization of AI applications.
This "gold rush," driven by AI computing power, signifies far more than the value of the precious metal itself. It profoundly reveals that, in the race towards the pinnacle of intelligence, cutting-edge AI performance depends not only on top-tier algorithmic design and architectural innovation but is deeply rooted in breakthroughs in fundamental materials science and the extreme refinement of precision manufacturing processes. From the uniform dispersion of nano-scale gold powder to the interconnection reliability of micro-scale packaging, the precision of every link constitutes an indispensable component of the foundation for trillions of computations. The 3 roll milling machine, and the state-of-the-art precision manufacturing capability it represents, is precisely the silent "precision calibrator" ensuring the solidity of this foundation. It reminds us that the hard power of the intelligent era is often found within the most basic physics and processes.
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