How to Achieve Fine Dispersion of Conductive Paste ZYE Three‑Roll Mill Reduces Particle Fineness from 50 μm to 12 μm
As industries including electronic information, new energy, semiconductors and advanced packaging keep advancing toward high‑performance and high‑reliability solutions, conductive paste — a key material linking material properties and device manufacturing processes — faces higher requirements for dispersion uniformity, particle fineness and processing stability.
Especially for material systems such as conductive adhesives and electronic pastes, conductive fillers must be fully dispersed with resins, additives and other components. Large agglomerated particles inside the material will not only compromise paste uniformity, but also adversely affect subsequent coating, printing, dispensing and the stability of electrical conductivity.
For conductive pastes requiring further fine processing, large particles and agglomerates may create several process‑related challenges:
1. Insufficient material dispersion uniformity
Agglomeration of conductive fillers easily leads to inconsistent local material conditions, calling for improved dispersion performance.
2. Room for further optimization of particle fineness
Initial testing returns a fineness of 50 μm. The client expects grinding to further reduce particle size to obtain finer, more uniform paste for downstream applications.
3. Stable material output must be guaranteed during grinding
Conductive pastes generally feature certain viscosity and special material characteristics. Apart from fineness improvement, stable material passage through rollers must be ensured to prevent material leakage and uneven discharge.
Solution：
Recently, a Shanghai materials company conducted experimental validation on a conductive paste, aiming to improve dispersion and reduce internal particle fineness via fine grinding. ZYE Technology deployed the ZYTR‑50T three‑roll mill for the test. Through a three‑stage dispersion‑grinding process, material fineness dropped from the initial 50 μm to 12 μm, delivering experimental evidence for subsequent process optimization and large‑scale production.
For the client’s conductive paste, ZYE Technology ran tests with the ZYTR‑50T three‑roll mill together with a grind gauge. Gap adjustment and shear force between mill rollers enabled progressive dispersion and grinding, refining large particles and agglomerates within the material
Test Overview：
Client: A materials company in Shanghai
Test Material: Conductive paste
Test Equipment: ZYTR‑50T Three‑Roll Mill + Grind Gauge
▲ ZYE Technology ZYTR‑50T Three‑Roll Mill
Test Objective: Achieve more uniform material dispersion and reduce internal particle fineness via three‑roll milling.
Test Procedures：
1、Initial Measurement: Grind gauge reading = 50 μm
▲ Pre‑grind measurement with grind gauge
▲ Conductive adhesive material before grinding
2、Dispersion Process：
The ZYTR‑50T three‑roll mill performed paste dispersion and grinding in three stages to reduce particle size:
- Coarse mixing stage: roller gap 50‑20 μm
- Primary fine grinding: roller gap 20‑10 μm
- Secondary fine grinding: roller gap 15‑8 μm
Fine treatment with narrower roller gaps further homogenizes the material and breaks down residual large particles.
On‑site observations showed the ZYTR‑50T delivered even discharge without obvious leakage during operation, enabling stable multi‑stage grinding of conductive paste.
▲ Conductive adhesive material after grinding
3、Post‑grind Measurement: Grind gauge reading = 12 μm
▲ Post‑grind measurement with grind gauge
Test results from the ZYE ZYTR‑50T three‑roll mill, as indicated by grind gauge readings:
1. Successful fineness reduction: from 50 μm down to 12 μm, a 76 % decrease.
2. Process advantages
- Fineness can reach its minimum after one round of primary fine grinding. A third pass of fine grinding ensures evenly ground particles. Parameters can be further adjusted alongside formula optimization, and the process parameters are viable for mass‑production scale‑up.
- Rollers are made of imported nano‑grade ceramic with precision polishing. The rollers are easy to clean when processing colored conductive adhesives.
For materials such as conductive pastes and conductive adhesives, reducing particle size is only the first step. It is more critical to develop grinding processes compatible with given material formulas.
Preliminary validation using lab‑scale equipment helps materials enterprises answer key questions:
1. Whether the material is suitable for three‑roll milling;
2. Appropriate roller‑gap ranges;
3. Required number of grinding passes;
4. Achievable fineness level for the material;
5. Discharge stability throughout grinding;
6. Parameter scaling strategies for subsequent mass‑production processes.
This underscores the value of equipment‑based experimental validation in the materials R&D phase.
Industries covering electronic chemicals, advanced packaging materials and new‑energy materials continue to upgrade high‑performance materials and manufacturing workflows. Demand for fine processing of functional materials including conductive paste will keep growing.
In this conductive‑paste test for the Shanghai materials company, the ZYTR‑50T three‑roll mill brought grind‑gauge fineness down from 50 μm to 12 μm (approximately 76 % reduction). The test verified the performance of multi‑stage grinding for this material system and provides references for future formula optimization and process scale‑up.
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