The "Lego" Revolution of Automotive Chips: Chiplet Packaging and the Precision Production of Adhesives for New Energy Vehicles
2026-05-13 14:17
As the computing power arms race in intelligent electric vehicles intensifies, Chiplet technology is igniting a "Lego-style" revolution in automotive chips. Chiplet technology involves integrating small chips (chiplets) with different functions and manufacturing process nodes—like assembling Lego bricks—using advanced packaging technologies to form a complete system-in-package (SiP) with complex functionality.
In the automotive industry, which demands extreme performance, cost efficiency, and rapid iteration, Chiplet technology has become a core choice for both OEMs and chip companies. Its core value is reflected in three dimensions:
- Ultimate Performance Unleashed: It enables efficient heterogeneous integration of chiplets for AI acceleration, image processing, in-vehicle communication, vehicle control execution, etc., perfectly matching the ever-increasing computing power and multi-scenario functional demands of advanced autonomous driving and immersive smart cockpits.
- End-to-End Cost Optimization: Eliminates the need to integrate all functions into a single, large, high-process-node expensive chip. Instead, it flexibly combines chiplets from different maturity process nodes, significantly improving chip production yield and drastically reducing R&D and manufacturing costs for high-end automotive chips.
- Rapid Product Iteration: By reusing verified, mass-producible mature chiplets, it greatly shortens the design, validation, and mass production cycles of new automotive chips, enabling fast response to the rapidly iterative market demands of automotive electronics.
When Chiplet Meets Automotive: Automotive Adhesives Face Three Ultimate Challenges
While Chiplet technology brings transformative upgrades to automotive chips, it also poses unprecedented extreme challenges for a key supporting material in chip packaging—automotive adhesives. The complex structure and harsh operating conditions of automotive-grade Chiplet packaging elevate the performance, process, and reliability requirements for automotive adhesives to entirely new heights. The core challenges concentrate on three aspects:
- More Complex Thermomechanical Stress Environment, imposing ultimate demands on the stress-buffering capacity of adhesives. Inside Chiplet packaging, heterogeneous material interfaces such as silicon, ceramics, metals, and organic substrates coexist. The significant differences in coefficients of thermal expansion (CTE) among these materials generate complex and high-frequency thermomechanical stresses under the wide temperature cycling range of -40°C to 150°C in automotive scenarios. This requires automotive adhesives to possess a lower CTE, excellent stress buffering, and low modulus characteristics to effectively suppress warpage, interfacial delamination, and cracking in multi-layer stacked chiplets, ensuring long-term stability of the package structure.
- Stricter automotive-grade reliability thresholds, demanding zero-defect requirements for adhesive consistency and durability. Automotive-grade AEC-Q200 certification is a hard access standard for automotive electronic components entering the supply chain. Its testing standards and failure control requirements are far more stringent than those for consumer-grade products. Automotive adhesives must pass thousands of hours of rigorous tests, including high-temperature high-humidity, thermal cycling shock, and high-intensity mechanical vibration, while also meeting a service life requirement of over 15 years in automotive scenarios. The failure rate must be controlled to an extreme level below 0.02 ppm. Any minute defect within the adhesive material can become a fatal hidden danger, potentially causing failure of the entire vehicle's electronic system.
- Higher Precision Packaging Process Requirements, demanding fine-scale processability from adhesives. Chiplet packaging features ultra-high integration density, with chiplet stacking gaps and bump pitches reduced to the micron level. This requires supporting adhesives such as underfill, encapsulation, and thermal conductive bonding adhesives to possess excellent flowability, penetrability, and thixotropy, enabling void-free and bubble-free precise and uniform filling within micron-scale gaps. Furthermore, the curing process must be perfectly compatible with automated automotive chip production lines, ensuring yield and efficiency in mass production.
ZYE Vacuum Degassing Technology Fortifies the Core Defense Line in Precision Production of Automotive Adhesives
Throughout the entire R&D, production, and application process of automotive adhesives, tiny bubbles trapped inside the adhesive material represent one of the core pain points preventing them from meeting the requirements of automotive-grade Chiplet packaging. Whether it is air entrained during mixing and stirring of the adhesive, or bubbles formed from trace volatiles inherent in raw materials, even micron-sized bubbles can cause a series of fatal problems:
- Stress Buffering Aspect: Bubbles cause localized stress concentration within the adhesive, significantly reducing its impact resistance and warpage resistance, and easily inducing interfacial delamination during temperature cycling.
- Reliability Aspect: Bubbles compromise the adhesive's insulation, sealing, and thermal conductivity, accelerating aging and failure under high-temperature high-humidity automotive operating conditions, directly violating the automotive-grade failure rate control red line.
- Process Aspect: Bubbles lead to voids during filling of micron-scale gaps, causing a sharp drop in dispensing yield and failing to meet the precision mass production requirements of Chiplet packaging.
As a core supplier of precision material processing equipment in China, Suzhou ZYE Precision's vacuum degassing mixer, powered by its core "revolution + rotation planetary degassing technology", provides a full-process precision production solution for automotive-grade Chiplet packaging adhesives, fundamentally solving the problems of residual bubbles and material uniformity.
The equipment's core working principle is a non-invasive planetary revolution + rotation dual-drive system: Inside a high-vacuum sealed chamber, the holder rotates rapidly around the central axis. The strong centrifugal force pushes the adhesive material downward along the vector direction, forcing internal bubbles to the material's surface. Simultaneously, the holder rotates at high speed on its own axis; this rotation, combined with the revolution force, creates a vortex-like flow, achieving thorough and uniform dispersion of fillers and resin within the adhesive. Finally, supplemented by a -100KPa high-vacuum environment, bubbles that have risen to the surface are completely evacuated and burst, accomplishing "mixing-dispersing-degassing" in one step. The entire process is blade-free, non-contact, and non-contaminating, fundamentally avoiding secondary air entrapment during mixing, perfectly meeting the high cleanliness, high uniformity, and bubble-free production requirements of automotive-grade adhesives.
Effect of different metal pastes after three-roll mill processing
Effect of different materials after mixing and degassing with vacuum mixer
ZYE Solutions Empower the Upgrade of the Chiplet Automotive Chip Industry Chain
With the rapid deployment of advanced autonomous driving technologies, Chiplet has become the core technical pathway for high-end automotive chips. The precision production of automotive adhesives is a critical foundational support for the large-scale implementation of Chiplet technology in the automotive sector.
ZYE Technology not only provides stand-alone vacuum degassing solutions but also integrates two core products—precision three-roll mills and vacuum degassing mixers—to create a one-stop "dispersion-milling-degassing" full-process solution, covering the entire lifecycle from formulation R&D to mass production of automotive-grade adhesives. Leveraging its deep understanding of both the electronic packaging and new energy vehicle sectors, ZYE Precision continuously uses its self-developed core equipment to help domestic automotive adhesive manufacturers break through technical barriers in high-end automotive-grade products. Simultaneously, it empowers automotive chip packaging companies to enhance the reliability and mass production capability of Chiplet packaging, fortifying the underlying process defense line for the "Lego" revolution of automotive chips, and contributing to the self-sufficiency, control, and high-quality development of China's intelligent connected vehicle and automotive electronics industry chains.
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